QFCS-thermal-solution | Advantech Select

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We see your challenges for optimized thermal design

Advantech understands your various challenges while developing high computing performance applications in medical, factory automation, and edge computing. Quadro Flow Colling System (QFCS) is designed for optimized thermal design. It ticks several boxes such as high heat dissipation efficiency, low noise margins, and a compact heatsink.

CPU Temperature Overheat
PCB Bending & CPU Crash
Solution for Space-limited System
High Noise Level
Complex Assembly Process & Extra Jig Cost

QFCS delivers…

100% Performance without Throttling @ 60°C
Silent Operating

Low Noise Design Reduces User Annoyance
Easy Assembly

Tool-free design to simplify assembly process
Thin & Light Cooling Solution

Thermal Technology Innovation

A

Two-phase heat exchange pipe

Dual copper heat pipes quickly equalize temperature
B

Mixed fin structure

Stacked & extrusion fins designed to maximize cooling surface and air exchange
C

CPU hard contact

Copper block dissipates heat quickly by making direct contact with CPU
D

Venting holes

Vertical airflow for expediting memory heat dissipation

Advantech Offering

Computer on Modules

SOM-5897 Series

6th Gen Intel® Xeon® / Core_™ Processors COM Express Basic Module Type 6
Learn More
SOM-5898 Series

7th Gen Intel® Xeon® / Core™ Processors COM Express Basic Module Type 6
Learn More
SOM-5899 Series

9th/8th Gen Intel® Xeon®/ Core_™ Processors COM Express Basic Module Type 6
Learn More

Single Boards Computers

MIO-5393

8th/9th Gen. Intel® Xeon®/ Core_™ Processor with 3.5" SBC w/ MIOe
Learn More
Industrial Motherboards

AIMB-228

AMD V1000/R1000 Processor Mini-ITX with 4 x Display Port
Learn More
EPC-T4000 Series

EPC-T4000 Series

8th/9th Gen Intel® Core™ Processors with Compact Design of the Enclosure
Learn More